GlobalFoundries said on Thursday it has reached a $2 billion, five-year agreement to manufacture silicon interposers for TSMC at its facility in Malta, New York. Silicon interposers are critical components used in advanced AI chip packages, allowing processors and memory chips to communicate at high speeds.
Under the agreement, GlobalFoundries will expand manufacturing capacity at the New York facility, which is expected to become the first U.S.-based source of silicon interposers for advanced chip-packaging technologies. Production is expected to begin ramping up in the first half of 2028, with the deal also providing a framework for further capacity expansion as demand grows.
The agreement comes as advanced packaging has emerged as a major bottleneck for the AI chip industry, with demand outpacing available manufacturing capacity. GlobalFoundries shares rose about 4% in premarket trading following the announcement, reflecting investor optimism over the company’s expanding role in the rapidly growing AI semiconductor supply chain.
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